Speaker:
Prof. John Papapolymerou
The School of Electrical and Computer Engineering
Georgia Institute of Technology
Title:
Lightweight Multilayer Organic RF Front Ends For Microwave and MM-wave Applications
Date:
Thursday, May 6, 2010
Time:
11:00 am
Location:
DC 1331
Abstract:
During the last decade System-on-a-Package (SOP) RF Front Ends have
been proposed as an alternative solution to System-on-Chip (SOC) RF
architectures since they combine the best characteristics in terms of
electrical, mechanical and packaging performance at a very competitive
price. Initial limitations with respect to the useful frequency range
of low cost RF SOP solutions have been overcome with the development
of novel materials and fabrication techniques. This talk will present
our recent work on multilayer organic RF front ends for X/Ka-band remote
sensing and V-band high-speed wireless applications. Examples will include
the development of low cost, flexible, lightweight X/Ka-band phased
arrays with embedded SiGe and RF MEMS circuits using multilayer LCP/RXP
layers laminated in a 3-D configuration, as well as the development of
multilayer, high gain, broadband 60 GHz antenna arrays and circuits for
low cost Gbps wireless links.
Biography:
John Papapolymerou received the B.S.E.E. degree from the National
Technical University of Athens, Athens, Greece, in 1993, the M.S.E.E. and
Ph.D. degrees from the University of Michigan, Ann Arbor, in 1994 and
1999, respectively. From 1999-2001 he was an Assistant Professor at the
Department of Electrical and Computer Engineering of the University
of Arizona, Tucson and during the summers of 2000 and 2003 he was a
visiting professor at The University of Limoges, France. From 2001-2005
and 2005-2009 he was an Assistant Professor and Associate Professor,
respectively, at the School of Electrical and Computer Engineering of the
Georgia Institute of Technology, where he is currently a Professor. He has
authored or coauthored over 260 publications in peer-reviewed journals
and conferences. His research interests include the implementation of
micromachining techniques and MEMS devices in microwave, millimeter-wave
and THz circuits and the development of both passive and active planar
circuits on semiconductor (Si/SiGe, GaAs) and organic substrates
(liquid crystal polymer-LCP, LTCC) for System-on-a-Chip (SOC)/
System-on-a-Package (SOP) RF front ends.
Invited by:
Prof.
R. Mansour
