Characterization Equipment
The G2N Centre has a wide variety of thin film, device and circuit characterization tools.
See below for a list of characterization equipment at the G2N Centre.
Deposition Equipment
The G2N Centre has the deposition capabilities for a variety of semiconductor, dielectric and conductive thing films: amorphous, nanocrystalline and poly-Si, SiOx, SiNx, SiOxNy, SiC, SiCN, ITO, ZnO, Al, Cr, Mo, W, Ta, organic materials (both small molecule and polymers). The maximum substrate size varies form 3" to 12" depending on the system.
See below for a list of deposition equipment at the G2N Centre.
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Equipment
- Angstrom Evovac Vacuum Deposition System
- AJA Sputtering Tool
- CVE Sputtering System
- Edwards Sputtering System
- High temperature PECVD
- Intlvac Thermal/E-beam Evaporator
- PlasmaTherm 790 Series PECVD
- Reel to Reel Cluster Tool
- Selenium Evaporator
- WLOS Cluster Sputtering System
- WLO1 and WLO2 Deposition Systems
Etching
The G2N Centre has both wet etching and dry etching (F-based, O-based, and Cl-based dry etching (RF,ICP)) capabilities.
See below for a list of etching equipment at the G2N Centre.
Lithography Equipment
The G2N Centre has the UV contact lithography capabilities with resolution about 1 micrometer.
See below for a list of lithography equipment at the G2N Centre.
Packaging and Bonding Equipment
The G2N Centre has wafer dicing and wire bonding capabilities.
See below for a list of packaging and bonding equipment at the G2N Centre.