WLOS Cluster Sputtering System
WLOS sputtering provides a maximum deposition area of 39cm x 27cm. Substrate holders for 3", 5" and 6" circular and square wafers are available for Cr and Al metals using DC power supply and Mo using RF source.
The system features a substrate heater for sample treatment at temperatures up to 400 degrees Celsius.
The deposition rate of this system is in the range of 0.05 - 0.2 um/hr with very uniform film thickness and good conductivity.
Find out the costs to use the WLOS Cluster Sputtering Tool.