Edwards Sputtering System
Metals, semiconductors and dielectrics can be deposited using "sputtering" systems.
In Sputtering a gas is ionized by a DC or RF electric source. The ions are accelerated to a target and the impact sputters off atoms that are deposited on a substrate.
Edwards sputtering system is used to deposit Cr, Al and Mo metals on 3" wafers using Ar gas.
Both DC and RF power sources are available for sputtering. The deposition rate is controlled by varying the applied power, and can be as high as a few um/hr with good film quality in terms of conductivity and uniformity.
Find out the costs to use the Edwards Sputtering System.