DISCO DAD-2H/6 Dicing Saw
Dicing saw is used to dice or groove semiconductor wafers by employing a high-speed spindle fitted with an extremely thin diamond blade. Our DISCO DAD-2H/6 system can cut wafers of up to 6 inches in diameter.
Operator can load up to 10 types of programs by specifying the program number after such data as the X stroke, X speed, Y index, Z index, and theta index have been entered, and any program stored can be used at any time.
The machine can be controlled under manual, semi-auto, and full-auto operation modes, and four fixed modes (A, B, C, and D) of cutting are provided.
Detailed specifications are as follows.
- Wafer size: 2" to 6"
- X-axis:
- Max table stroke: 160 mm
- Cutting range: 1" to 6" in 1/2" increments
- Cutting feed speed: 0.3 to 30 mm/sec
- Y-axis:
- Max spindle stroke: 160 mm
- Spindle index range: 0.0001" to 4" in 0.0001" increments
- Indexing speed of spindle: 30 mm/sec
- Z-axis:
- Range of depth left uncut: 0.005 to 19.995 mm in 0.005 increments
- Cutting feed speed: 15 mm/sec
- Return clearance of spindle: 0.7 mm
- Cutting mode (FIX): A, B, C, and D
- Theta-axis:
- Rotation range: 0 to 90 degree in 1 degree increments
- x120 mag alignment microscope with 5" monitor TV
Find out what we charge to use the Dicing Saw.