Some of Facilities of SiDIC Lab.

• Clean Room Class 1000 (3200 sq. feet)
• Available Processes:
  • Integrated Bipolar Devices (including polysilicon emitter devices)
  • Polysilicon Gate NMOS and Metal Gate PMOS
  • Amorphous silicon Thin Film Devices
  • Integrated Microsensors and Micromachining
• Photo reduction and photorepeater camera.
• Sub-micron UV mask aligners with IR backside aligning capabilities.
• Two four tube furnace
• Rapid thermal processor
• Two plasma enhanced LPCDV system
• Electron beam evaporation system
• Three sputtering system with substrate heating, thickness monitoring, etching, and biasing capabilities
• Planar reactive ion etch system.
• Custom wet etch capabilities
• Disco DAD-2H/6 automatic dicing saw.
• Wire bonding capabilities
• Well equiped measurment and analysis lab (probe station, low temperature microprober, roughness tester, surface profiling, surface scanner)